Delivering 224G SerDes with a path to 448G to address AI ML bandwidth demand Presented by C

Empowering AI networking with SONiC

A Blueprint for Liquid Cooled AI Rack Clusters for Modern Datacenters Presented by Supermic

High Density Low Power Micro-LED based Optical Interconnects for Chip-to-Chip Communications

SERDES Clocking and Equalization for High-Speed Serial Links, Jack Kenney

Joint Webinar with NewPhotonics | Delivering the LPO Advantage Through the SiP Chip Value Chain

High Speed Board to Board Connector – The Road to 224Gbps Presented by Molex

From AI to Infrastructure Empowering the Future of Data Centers Presented by Micas Networks

Luceda IPKISS - OptiSystem Co-simulation: Bridging PIC Design and System Simulation

ROOM4 Conference TEKTRONIX Electrification AC to DC

OCP Networking - Switch Abstraction Interface Sub-Project call (Oct 07, 2024)

2024 ITC Diamond Event - Siemens

Chiplets & UCIe : Overview

Generative AI and the Outsized Role of Serdes - presented by Credo Semiconductor

The Future of WiFi

SERDES from 224 and beyond

How do Graphics Cards Work? Exploring GPU Architecture

GLOHRA Academy Series with Prof. Dr. Shadi Albarqouni

OCP Server - Composable Memory System Sub-project call (Nov 21, 2024)

room4 tektronics

OCP Server - Composable Memory System Sub-project call (Oct 04, 2024)